A thermal-materials brand of NGICA thermal-materials brand of NGICFrom AI server racks to satellites in low earth orbit — Lenecold thermal materials are deployed where heat must move without weight, drift or compromise.
From data-center server rooms to satellite payload bays, here is a snapshot of the markets Lenecold serves today.
Click any application to see how Lenecold thermal pad or thermal plate fits your thermal challenge.
Server CPUs, GPUs, AI accelerators, Switch ASICs, NVMe. Conventional thermal grease pumps out and dries; cold plates warp. Lenecold pad stays in place across the full socket lifetime — replace the TIM and forget it.
SiP, IGBT/SiC power modules, vapor chambers and heat spreaders. Miniaturization is pushing heat flux past 1 kW/cm². Lenecold's directional heat path and tunable CTE match silicon-to-substrate stack-ups — eliminating solder fatigue.
Traction batteries, domain controllers, power modules, OBC. From cell-to-pack battery modules to 800 V SiC inverters, every thermal interface must survive 10+ years of thermal cycling. Lenecold's solid, pump-out-free pad is the automotive-grade replacement for thermal grease.
mmWave base stations, RF front-end, phased arrays, edge compute. 6G radios run hot, light and exposed. Lenecold thermal plate combines copper-class conductivity at half the weight, with CTE you can match to the AlN or alumina carrier.
Satellite payloads, on-orbit compute, star trackers, T/R modules. Every gram on a satellite is a gram of payload. Lenecold thermal plate delivers 1.5–4 g/cm³ density with 1200 W/m·K conductivity — out-cooling aluminum while cutting thermal mass by up to 60% versus copper spreaders.
Drones, eVTOL, avionics, onboard compute, battery & e-drive. From a 5-kg inspection drone to a 2-tonne eVTOL, thermal mass is flight time. Lenecold materials move heat with minimum weight — extending endurance and allowing more aggressive flight profiles.
Deeper material for each vertical: the thermal budget, the bond line you will really get, and how to specify the interface.
700–1,200 W packages, 0.5–1.0 mm bond lines, and why solid pads beat grease over a five-year service life.
Read →Cell swelling, gap stack-up, fast-charge flux and cell-to-cell uniformity in liquid-cooled packs.
Read →Baseplate bow, power cycling and how interface resistance converts directly into cycle life.
Read →Sealed passive enclosures, solar load and a ten-year unattended service expectation.
Read →Why uniformity beats absolute temperature, and why thickness control decides it.
Read →Heat load, footprint, weight budget, ambient, expected lifetime. We'll recommend the right material and ship sample.
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