LenecoldA thermal-materials brand of NGIC
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Product · 02 / Structural

Graphene Thermal Plate

An ultra-high-conductivity, lightweight graphene plate for next-generation comms & aerospace — 6G mmWave base stations, satellite payloads, UAV and eVTOL avionics. Easy to cut, drill and finish.

Graphene thermal plate deployed across three application environments: 6G mmWave base-station RF front end (left), a satellite payload thermal spreader (center), and an eVTOL avionics enclosure (right).
Lenecold thermal plate in mmWave base stations, satellite payloads and eVTOL avionics — copper-class conductivity at less than half the weight.

What it is

Lenecold Thermal Plate is a dense, machined-ready plate of vertically-aligned graphene. The through-plane heat path is continuous, but the plate is also isotropic enough in-plane to be cut, drilled and surface-finished like engineered aluminum or copper — without chipping or delamination.

Why it wins

Conventional heat-spreader materials force a trade-off. Copper is heavy and CTE-mismatched. Aluminum is light but conducts poorly. Diamond/copper composites conduct brilliantly but cost an order of magnitude more. Lenecold thermal plate delivers copper-class conductivity at less than half the weight, with CTE tunable to match the silicon or ceramic stack-up.

Key specifications

  • 1200 W/m·K

    Through-plane conductivity

    Directional graphene network forms a continuous through-thickness heat channel — one of the highest values available in any machinable plate format.
  • 1.5–4 g/cm³

    Ultra-low density

    Significantly lighter than copper (8.96) and aluminum (2.7). Weight-sensitive platforms (UAV, satellite, eVTOL) gain payload or range.
  • 4–12 ppm/K

    Tunable CTE

    Match the coefficient of thermal expansion to silicon (3 ppm/K), alumina (7 ppm/K) or aluminum nitride (4.5 ppm/K) — eliminating solder fatigue at thermal-cycled joints.
  • Machinable

    Easy to cut, drill & composite

    Standard CNC tooling. Surface composites (Cu-clad, Ni-plated, anodized) available for solder mounting or direct bonding.
  • Cost-effective

    Far below diamond/copper

    Comparable performance envelope to diamond/copper composites at a fraction of the cost — scalable for mass-market deployment.

Performance vs. alternatives

5-axis comparison: thermal conductivity · cost · machinability · weight · CTE. Higher = better.
Thermal Conductivity Cost-effective Machinability Lightweight Low CTE
Lenecold Graphene Plate Diamond / Copper Copper Aluminum
Result: only the Lenecold graphene plate occupies the entire performance envelope — top-tier conductivity at a competitive cost, fully machinable, lighter than aluminum, with CTE you can tune to the rest of the stack.

Format & supply

Standard plates up to 300 × 300 mm, thicknesses from 0.5 mm to 10 mm. Custom thicknesses, surface composites (Cu-clad, Ni/Au plating, anodized) and pre-machined heat spreaders on request. MOQ for custom: 50 pcs. Sample lead time: 7 business days. Production lead time: 3–4 weeks.

Request Quote & Sample →
Lenecold graphene thermal plate stock — thin black panels in multiple thicknesses, including a die-cut sample on a white background, showing the dense, finely-finished surface and uniform colour characteristic of NGIC's vertically-aligned graphene material.
Lenecold thermal plate stock — thin black panels in 0.5 / 1.0 / 2.0 / 3.0 mm thicknesses, supplied as blanks or die-cut to your drawing.

Spec a graphene plate for your platform.

Send us your heat load, footprint, weight budget, CTE requirement and surface finish. We'll propose a plate spec and ship sample for evaluation.

Start a Project →