A machinable plate with 1200 W/m·K through-plane conductivity and a density of 1.5–4 g/cm³. It is not a gap filler — it is a structural heat spreader for applications where every gram matters and copper is simply too heavy.
Specification
| Property | Value | Why it matters |
|---|---|---|
| Through-plane thermal conductivity | 1200 W/m·K | Comparable to copper by weight, far better by mass |
| Density | 1.5–4 g/cm³ | One fifth to one half the density of copper |
| CTE | 4–12 ppm/K | Tunable to match semiconductor and ceramic substrates |
| Standard size | Up to 300 × 300 mm | Larger formats on request |
| Thickness range | 0.5–10 mm | Machined to final geometry |
| Processing | Easily machined | Mill, drill, and plate like a metal |
| Surface options | Cu-clad, Ni/Au plating, anodized | Solderable or corrosion-resistant finishes |
Copper, aluminium or graphene plate
| Material | k (W/m·K) | Density (g/cm³) | Specific conductivity (k ÷ density) |
|---|---|---|---|
| Copper | 400 | 8.96 | 45 |
| Aluminium | 237 | 2.70 | 88 |
| Graphene plate | 1200 | 1.5–4 | 300–800 |
Read the last column carefully. On a per-kilogram basis the graphene plate outperforms copper by roughly an order of magnitude — which is the entire reason it exists.
Where it earns its cost
- Aerospace and satellite — launch mass is priced by the kilogram, and radiator area is limited.
- UAV and eVTOL — every gram removed from thermal hardware is payload or range.
- 6G and mmWave — high-flux RF front ends with tight mass budgets.
- Portable and wearable — where a copper spreader would be unacceptable on weight.
- CTE-critical assemblies — tunable expansion between 4 and 12 ppm/K avoids the mismatch that cracks solder joints.
When to use a pad instead
The plate is rigid. If you need to bridge a variable gap between two surfaces, you want the 180 W/m·K thermal pad. The two are often used together: pad to cross the gap, plate to spread the heat once it arrives.
Request samples or a quote
Tell us thickness, footprint, volume and target thermal resistance. Samples ship in 7 business days; production in 3–4 weeks. Contact engineering →
Frequently asked questions
Can it be machined like metal?
Yes — the plate mills and drills readily, and accepts Cu cladding, Ni/Au plating or anodizing. Send us the finished geometry and we will quote machined parts rather than blanks.
What is the MOQ for custom plates?
50 pieces for custom sizes and thicknesses. Sample lead time 7 business days, production 3–4 weeks.
How does the CTE compare to copper?
Copper is around 17 ppm/K, which is far above most semiconductor and ceramic substrates. Our plate is tunable between 4 and 12 ppm/K, letting you match the mating material and reduce thermal-cycling stress.
Is it a replacement for a heat pipe or vapour chamber?
Not directly. Those move heat over distance; the plate spreads it locally with very high conductivity and very low mass. In weight-critical designs it frequently removes the need for a heat pipe altogether.