Power electronics breaks the rules that work for logic chips: large areas, low and uneven clamping pressure, millions of thermal cycles, insulation and flame requirements. This page indexes everything we publish on IGBT, SiC, battery and rail applications.
The reading path
| Step | Page | What you get |
|---|---|---|
| 1 | IGBT & SiC interfaces | Why modules fear thermal cycling, and the 10% interface rule of thumb |
| 2 | IGBT application page | Where the pad sits in a module stack, with real dimensions |
| 3 | EV battery interfaces | Why local voids, not conductivity, decide pack thermal behaviour |
| 4 | EV & ESS application page | Pad and plate options for module-level and serviceable packs |
| 5 | Rail transit (EN 50155) | Temperature classes and vibration requirements for 30-year service |
| 6 | Clamping pressure | Low-pressure behaviour - the 5 psi trap where thin pads lose |
| 7 | Hardness & compression | Selecting thickness against worst-case gap and compression set |
The one-paragraph summary
A power module sees 10–30 psi of uneven clamp across 20–100 cm², swings −40 to +150 °C a million times, and must stay insulated and flame-retardant while doing it. Under those conditions the interface barely contributes steady-state temperature - what it must not do is harden, thin out, or crack over the years. Compression set and drift data matter more here than headline conductivity.
Specification checklist
- Material selected at the lowest real clamp pressure, not the nominal one.
- Compression set data (ASTM D395) - we do not run it routinely, it can be arranged per project.
- Insulation: high volume resistivity, no exposed conductive filler; dielectric strength per your stack.
- Flame class: UL94 V-0 available; EN 45545 not held - arrange third-party testing for rail.
- Automotive PPAP / IATF 16949: not available - industrial, PV, storage and charging are our lane.
Where we say no. Traction-grade automotive with full PPAP is outside our current system scope - we say
so up front rather than after your audit. Industrial drives, solar inverters, ESS PCS and charging piles are
well covered. Talk to engineering →
Frequently asked questions
Pad or grease for power modules?
Industrial modules mostly use grease or PCM on cost; solid pads win where service life, maintenance intervals and rework matter.
Does SiC really need a thinner interface?
Smaller die means higher local flux, so yes - but below ~0.2 mm flatness tolerance dominates. Most projects land at 0.2–0.3 mm.
Do you have automotive references?
We supply battery and onboard-electronics projects, but without full IATF 16949. State requirements early.